Wire processing is a unique ultra-fine-grained (nanocrystalline or submicron-crystalline) metal and alloy material preparation technology developed in recent years. This refers to the material being in a lower temperature environment (usually less than 0.4tm). A process in which rapid plastic deformation occurs under large external pressure, thereby refining the grain size of a material to submicron or nanometer levels. Plastic deformation with strong strain and large plastic deformation can significantly refine the microstructure of metal materials under low temperature conditions, greatly improving its Strength and toughness, then, let’s learn about the characteristics of wire processing!

Wire processing is used as a wide range of engineering materials and has the unique characteristic that one dimension is much smaller than another dimension, so its structure is between large materials and small materials. Obviously, as the thickness of the wire foil decreases, the ultrasonic vibration acting in the thickness direction is expected to bring comprehensive spd introduction to the entire wire foil. However, there is currently no high-performance wire manufacturing technology and technology for ultra-fine metal wires and ultra-thin strips. device.

Characteristics of wire processing:

1. Wire processing uses the effect of ultrasonic plastic waves to apply high-frequency and high-strain-rate ultrasonic vibration shock to micron-level foil or wire, so that ultra-fine wire or ultra-thin strip can effectively and uniformly produce large plastic deformation, making The grains are obviously refined; experimental research and simulations show that this process can effectively refine the grains in the thickness direction of micron-level wires or strips, and the grain size and shape are evenly distributed, which can significantly improve the performance of the wires or strips. Comprehensive mechanical properties.

2. The wire processing operation is simple. Repeated ultrasonic vibration impacts under different temperature conditions can achieve severe plastic deformation of metal or metal wires and strips, so that the grains are refined into sub-micron and nanometer scales, forming uniform size distribution. The manufacturing mold for high-performance wires made of ultra-fine grain materials can achieve continuous multi-pass uniform introduction of large plastic deformation into micron-thick wires without significantly changing the cross-sectional size, greatly improving material performance and having practical engineering applications. value.

3. The wire processing device is equipped with an airtight container that holds the coolant. On the opposite side of the airtight container, there are respectively an inlet and an outlet for the wire or strip to pass through. Multiple sets of conveying rollers are set outside the container so that the wire or strip can be processed continuously. By performing impact treatment in a closed container, this device can continuously introduce large plastic deformation. The coolant maximizes the temperature rise during the impact of the ultrasonic roller. The wire and strip are combined with the ultra-low temperature environment during impact treatment to obtain Special low-temperature impact on the fine-grained structure can significantly improve the mechanical properties of the wire. During the severe plastic deformation process of the material, recrystallization and grain recovery occur simultaneously internally, and a balance is reached under the combined effect of the two, which determines the small grain size that the material can achieve under the process conditions. Therefore, reducing the temperature factor will have an important effect on inhibiting crystallization. Grain recovery has obvious effects, and smaller grain sizes can be obtained.

4. The low-temperature ultrasonic rolling impact device involved in the design of wire processing has a pressure plate removably installed on the upper surface of the ultrasonic transducer and a pressure cylinder arranged above the pressure plate. A spring is connected between the pressure cylinder and the pressure plate. The pressure cylinder The upper end is a fixed end that separates the pressure plate from the ultrasonic transducer and fixes the ultrasonic transducer. The ultrasonic tool head and the rigid impact roller can be rotated to fix the position to meet the needs of the roller end limit in the ultrasonic roller processing device. ; Install the pressure plate on the transducer. The pressure plate can be driven by the pressure cylinder to move the ultrasonic transducer up and down, and the pressure on the wire and strip at the end of the roller can be controlled by the pressure cylinder. In the ultrasonic roller processing device The roller ends are constantly loaded with static pressure

Wire processing can effectively refine the grains in the thickness direction of micron-level wires or strips, and the grain size and shape are evenly distributed, which significantly improves the comprehensive mechanical properties of the wires and strips. The provided device can continuously introduce serious Plastic deformation realizes continuous low-temperature ultrasonic impact spd strengthening treatment of wire and strip, satisfying two impact treatment methods, and has good application value.

The above introduction is the characteristics of wire processing. If you need to know more, you can contact us at any time!